Fermilab

ASIC Presentations


Go To Year 2015.
Go To Year 2014.
Go To Year 2013.
Go To Year 2012.
Go To Year 2011.
Go To Year 2010.
Go To Year 2009.
Go To Year 2008.
Go To Year 2007.
Go To Year 2006.
Go To Year 2005.
Go To Year 2004.
Go To Year 2003.
Go To Year 2002.
Go to Year 2001.
Go To Year 2000.

2015

2014

2013

2012

2011

2010

Details of the First 3D-IC Multi-Project Wafer Run
By G. Deptuch, M.Demarteau, J.Hoff, R. Lipton, R. Patti, A. Shenai, M. Trimpl, R.Yarema, T.Zimmerman <> IEEE NSS-MIC, Knoxville, TN
October 30 - November 6, 2010

SOI Detector with Drift Field due to Majority Carrier Flow - an Alternative to Biasing in Depletion
By M. Trimpl, G. Deptuch, R. Yarema <> IEEE NSS-MIC, Knoxville, TN
October 30 - November 6, 2010

Monolithic Active Pixel Matrix with Binary Counters
By Farah Khalid, Gregory Deptuch, Alpana Shenai, Raymond Yarema <> IEEE NSS-MIC, Knoxville, TN
October 30 - November 6, 2010

3D SOI Design at FermiLab MAMBOIII
By Farah Khalid, Alpana Shenai, Gregory Deptuch, Raymond Yarema <> 19 th International Workshop on VERTEX Detectors, Loch Lomond, Scotland
June 9, 2010

3D SOI Design at FermiLab MAMBOIII
By Farah Khalid, Alpana Shenai, Gregory Deptuch, Raymond Yarema <> Monolithic Active Pixel Matrix with Binary Counters
March 4, 2010

MAMBO III User Manual
By Farah Khalid, Alpana Shenai, Gregory Deptuch <> Microelectronics ASIC Design
March, 2010

ATLAS-CMS Power Working Group
By M. Trimpl <> Recent SPi tests and setups
March 31, 2010

Frontend Electronics in SOI at FERMILAB
By Farah Khalid, Alpana Shenai, Gregory Deptuch, Raymond Yarema <> Monolithic Active Pixel Matrix with Binary Counters
April 25, 2010

3D-IC Technology for Future Detectors
By Grzegorz Deptuch
February 17, 2010

2009

Discussion of process features to target optimum monolithic SOI Pixel Detectors
By Grzegorz Deptuch <> Monolithic Pixel Detectors in a Deep Submicron SOI Process, TIPP, Tsukuba, Japan
March 11, 2009

Serial Powering Using the SPi Chip
By M. Trimpl <> Front End Electronics, Montauk, New York
May 19, 2009

Opportunities for HEP Instumentation Using 3D Circuits
By Ray Yarema <> TIPP 2009, Tsukuba, Japan
May, 2009

FPhx Digital Architecture Review Checklist
By Jim Hoff <> Front End Electronics, Montauk, New York
May, 2009

3D Design Activities at Fermilab and Associated Opportunities for Physices
By Ray Yarema <> For 11 th Pisa Meeting on Advanced Detectors, La Biodola, Isola d'Elba, Italy
March, 2009

Development of Vertically Integrated Circuits for Particle Detectors
By M. Trimpl <> For Symposium on Semiconductor Detectors, Wildbad Kreuth, Germany
June 10, 2009

2008

3D Circuit Design at Fermilab
By Ray Yarema <> For Vertical Integration Technologies for HEP and Imaging Workshop, Tegernsee, Germany
April 6-9, 2008

3D Technology Issues and On-going Developments at FNAL
By Ray Yarema <> For ILC Vertex Workshop, Mennagio, Italy
April 23, 2008

3D and SOI Integrated Circuit Design at Fermilab for HEP and Related Applications
By Ray Yarema and G. Deptuch <> For 2008 NSLS/CFN Users Meeting, Workshop on Detectors, Brookhaven
May 21, 2008

Vertical Integration of Integrated Circuits and Pixel Detectors
By Grzegorz Deptuch <> For 17 th International Workshop on Vertex Detectors, Uto Island, Sweden
July, 2008

3D IC Pixel Electronics-the next challenge
By Ray Yarema <> For TWEPP-08, Naxos, Greece
September 15 - 19, 2008

The SPI(Serial Powering Interface) Chip
By M. Trimpl <> For TWEPP Workshop, Naxos, Greece
September 17, 2008

First Results of SOI-based Integrated Detector and Electronics at Fermilab
By M. Trimpl, G. Deptuch, R. Yarema <> For LCWS, chicago, Illinois
November 17, 2008

2007

SOI Detector and 3D Integrated Circuit Development for HEP
By Ray Yarema <> For ILC Pixel Group at FNAL
February 22, 2007

3D and SOI Technology for Future Pixel Detectors
By Ray Yarema <> For Common Atlas/CMS Electronics Workshop, CERN
March 19-21, 2007

3D Circuit Integration of Vertex and Other Detectors
By Ray Yarema <> For Vertex 2007, Lake Placid, New York
September 25, 2007

3D Circuit Integrated Circuit for Pixel Applications in High Energy Physics
By Jim Hoff, Grzegorz Deptuch, Tom Zimmerman, Ray Yarema <> For NSS 2007, Hawaii
October, 2007

Review of 3D Related Technologies for HEP
By Ray Yarema <> For LHC-ILC Workshop on 3D Integration Techniques, Paris, France
November 29, 2007

2006

Development of 3D Integrated Circuit for HEP
By Ray Yarema <> 12th LHC Electronics Workshop, Valencia, Spain
September 25-29, 2006

3D Integrated Circuits for HEP
By Ray Yarema <> Sixth International Meeting on Front End Electronics in Perugia, Italy
May 17-20, 2006

Fermilab Initiatives in 3D Integrated Circuits and SOI Design for HEP
By Ray Yarema <> ILC Vertex Workshop Ringberg Castle in Tegernsee, Germany
May 29-31, 2006

The NOVA APD Readout Chip
By Tom Zimmerman <> FEE 2006 in Perugia, Italy
May 19, 2006

Single Event Upset Tolerance in IBM 0.13um
By Jim Hoff <> 5th Int. Meeting on Frontend Electronics in Perugia, Italy
May, 2006

2005

A New Prototype 10u by 340u Pixel Cell in a 0.13u CMOS Process for Future HWP Application
By Abder Mekkaoui, Jim Hoff, Ray Yarema. <> Pixel 2005, International Workshop on Semiconductor Pixel Detectors for Particles and Imaging in Bonn, Germany
September, 2005

A Custom Integrated Circuit for Calorimetry at the International Linear Collider
By Jim Hoff, Abder Mekkaoui, Ray Yarema Fermi National Accelerator Laboratory; Gary Drake, Jose Respond Argonne National Laboratory. <> IEEE NSS 2005, Puerto Rico
October 25, 2005

FSSR2, a Self-Triggered Low Noise Readout Chip for Silicon Strip Detectors
By Valerio Re, Massimo Manghisoni Universita di Bergamo and INFN, Pavia, Italy; Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory; Lodovico Ratti Universita di Pavia and INFN, Pavia, Italy. <> IEEE Nuclear Science Symposium, Puerto Rico
October 24 - 27, 2005

Challenges in Front-end Electronics for Future HEP Experiments
By R. J. Yarema. <> 14th International Workshop on Vertex Detector Nikko, Japan
November, 2005

ASIC Research and Development at Fermilab
By Ray Yarema. <> Super B Factory Workshop in Honolulu, Hawaii
April 20-22, 2005

Fermilab ASIC and electronics R&D for Linear Collider
By William Wester, Ray Yarema. <> 2005 International Linear Collider Workshop Stanford University, California
March 18-22, 2005

2004

Fermilab Silicon Strip Readout Chip for BTEV.
By Ray Yarema, Jim Hoff, Abderrezak Mekkaoui, Massimo Manghisoni, Valerio Re , Valentina Angeleri, Pier Francesco Manfredi, Lodovico Ratti, Valeria Speziali. <> Nuclear Science Symposium.

The Future of Deep Submicron IC Design for HEP.
By Ray Yarema. <> 9th; Workshop on Electronics for LHC Experiments.

2003

Testing Experience with TSMC 0.25 µm.
By W. Wester. <> FEE2003.

Trip Chip.
By Paul Rubinov. <> FEE2003.

A New Deep Submicron Readout IC for the Tevatron
By Brad Krieger, M. Garcia-Sciveres, C. Haber, H. von der Lippe, E. Mandellie , M. Weber, L. Christofek, K. Hanagaki, J. Hoff, M. Johnson, A. Nomerotski , P. Rapidis, M. Utes, W. Wester, R. Yarema, T. Zimmerman, S. Alfonsi , N. Bacchetta, S. Centro, G. Meng, D. Pellet, T. Wilkes, W. Yao. <> FEE2003.

Test Results from the SVX4.
By Len Christofek(University of Kansas). <> FEE2003.

SEU Tolerance of Different Register Architectures in a 0.25µm CMOS Process.
By Jim Hoff, William Wester, Brad Hall, Paul Rubinov, Suen Hou, P.K. Treng. <> FEE2003.

The Design of a Charge Integrating, Modified Floating Point ADC Chip for Calorimeters.
By Tom Zimmerman. <> FEE2003.

FPIX2: A Pixel Readout Chip with 840 Mb/s IO bandwidth.
By A. Mekkaoui, J. Hoff, D. Christian, R. Yarema. <> FEE2003.

Readout Ideas for Phenix Silicon EndCap.
By R.J. Yarema, Jim Hoff, Abder Mekkaoui. <> Phenix Collaboration Meeting.

A New Floating Point Readout Chip for CMS Calorimeters.
By R. Yarema, T. Zimmerman. <> 9th Workshop on Electronics for LHC.

SVX4 Silicon Readout Chip for Fermilab.
By R.J. Yarema. <> Phenix Collaboration Meeting.

Highlights of the 5th International Meeting on Front End Electronics.
By Ray Yarema. <> Vertex 2003.

2002

Channel Control ASIC for the CMS Hadron Calorimeter Front End Readout Module.
By Ray Yarema, Alan Baumbaugh, Ahmed Boubekeur, John Elias, Theresa Shaw. <> 7th Workshop on Electronics for LHC.

2001

Radiation Test Results of Pixel Circuits Built in Two Different 0.25 µ Processes.
By Abderrezak Mekkaoui, Jim Hoff, Dave Christian, William Wester, Ray Yarema. <> RD-49 Meeting.

2000

Wafer level Testing of ASICs for Silicon Strip Detectors.
By Ray Yarema, William Wester. <> 4th International Meeting on Front End Electronics for Tracking Detectors at Future High Luminosity Colliders.

preFPIX2: Core Architecture and Results.
By J. Hoff, A. Mekkaoui, D. Christian, S. Zimmerman, G. Cancelo, R.Yarema. <> Nuclear Science Symposium, Lyon France.