Electrical Engineering Department


The Particle Physics Division Electrical Engineering Department provides support for a wide variety of High Energy Physics projects as well as many other science experiments. Our work is far-ranging and our products can be found at Fermilab, CERN and many other locations. The department works on detector front-end electronics, astrophysics, and other basic science experiments. Support is available for new experiments in terms of consulting and infrastructure design. Long-term support is available for any operating experiments. Many design and support disciplines are available within EED. Engineering expertise is available for digital, analog, ASIC, controls, systems, and power supply design. Skilled drafting resources are available for schematics, board layouts, construction drawings, mechanical drawings, and general documentation. Fabrication support is available for circuit boards, chassis, cables, surface mount assemblies, and various modules. Testing capabilities range from general board level testing to integrated circuit wafer level and packaged part testing. Most jobs are handled from design, through fabrication, testing, and installation.


ASIC Development

The ASIC group has several experienced engineers doing design and layout of analog, digital and mixed (analog/digital) circuits.

Services and capabilities:
  • Digital, analog and mixed Application Specific Integrated Circuit design
  • Radiation hard circuits >30 Mrads designed in commercial deep sub-micron processes
  • Development of 3D integrated circuits
  • Automated testing of ASICs at both the wafer and chip level
For more information, visit the ASIC Development page.



Detector Electronics

The Detector Electronics Group participates in all stages of the electronics development process. Project support can be provided for all aspects of electrical and electronics design. We will work with project scientists to develop functional requirements and specifications for electronics systems.

Services and capabilities:
  • System architecture design
  • Low noise circuit design
  • Printed Circuit Board design
  • Firmware design
  • Check-out, commissioning and maintenance of electronics modules.
For more information, visit the Detector Electronics page.



Infrastructure Support

The Infrastructure and Support Group provides support on the infrastructure aspects of projects from conceptual design through final implementation.

Services and capabilities:
  • Provide guidelines on
    • Electrical Design Standards
    • Cable Selection
    • Electrical Safety Reviews
    • Networked Design Tools
  • Design assistance for AC, DC, and high voltage power supply and distribution
  • Design of equipment cooling, rack protection, cabling
  • Electronics procurement and fabrication including prototyping, reworking, etc.
For more information, visit the Infrastructure Support page.



ATCA information to be entered



COLd DAta Transmission ASIC for DUNE Data transmission from cryostat to warm side at 1.2Gbps over up to 30m of Cu links and for control of Front- End and ADC chips, collaborations with SMU and BNL



for DUNE 12b, 2Msps ADC for DUNE liquid Ar TPC, collaboration with LBL, BNL



CMS- Compact Muon Solenoid is a detector which uses huge solenoid magnets to bend the paths of particles from collisions in the LHC.



DUNE - Deep Underground Neutrino Experiment is a leading edge, international experiment for neutrino science and proton decay studies.



Fast Timing Integrated Circuit for CMS Endcap Timing Detector 4×24 pixel RO IC providing ~20ps resolution for 1×3 mm2 pixel LGAD sensors, collaborating with SLAC?, UCSC?



Fermi-Argonne Silicon Pixel Array X-ray Extremely high dynamic range (up to 105 photons/pixel/pulse) pixel camera for 8-12 keV X-rays, (started as funded by APS-ANL Upgrade ─ SOW, now: Phase I commercialization SBIR grant with FieldViewers)


FCP130/iFCP65 and RD53A:

Fermilab CMS Pixels (RD53 collaboration) Pixels for CMS Phase2 Upgrade + CERN RD53 in TSMC 65nm process, Univ. of Bergamo Italy (iFCP), KA25



Fermilab-LCLS CMOS 3D-integRated with Autogain Soft 0.2-2 keV X-rays, high speed 10kfps, high dynamic range 103, 2M pixel camera for LCSL II, (Fermilab- SLAC) 2-year R&D funded by DOE-BES (FWP)



G2 information to be entered



High Granularity Calorimeter Data Concentrator for CMS 72×1Gbps ? 4×10Gbps tranceiver for trigger data and event data readout, collab. w. CERN, Omega France



MicroBoone information to be entered



minerva information to be entered



ProtoDUNE information to be entered



Vertically-Integrated Photon Imaging Chip - Large Fully 3D-integrated,1.2M pixel camera for X-ray Photon Correlation Spectroscopy, 8-12 keV X-rays, 0.7Tbs of data (BNL, ANL, Fermilab), DOE-BES (FWP)



Vertically-Integrated Pattern Recognition Associate Memory 3D-integrated hardware tracking for Phase 2 CMS Upgrade, (Fermilab, NWU) funded through KA25 and CMS